Buy Thermal Management Part Number 341800F00000G Manufactured By Boyd (Formerly Aavid)

Mfg Part Number : 341800F00000G

Manufacturer : Boyd (Formerly Aavid)

Main Category : Thermal Management

Category : Heat Sinks

Sub Category : Fpga And Bga Heat Sinks

Description : Boyd 341800f00000g - 76.2mm Length, 19.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications.

As a leading online distributor, we at Speedy Electromechanicals are the ultimate procurement hub for customers looking to secure dependable Thermal Management parts. You have reached the RFQ page for part number 341800F00000G, a Boyd (Formerly Aavid) item that is listed alongside the description “Boyd 341800f00000g - 76.2mm Length, 19.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications..” If part number 341800F00000G catches your eye, be sure to request a quote for your comparisons using the form below. By offering us important information such as your target price, expected shipping time frame, and more, we can best formulate and present a solution that caters to your unique needs and limitations.

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-and-conditions/ . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

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Alongside part number 341800F00000G, we also have many other Boyd (Formerly Aavid) products that you can take advantage of. In addition, with our AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, you never have to worry about the fit, form, or function of your purchased electromechanical parts. Moreover, we are ready to meet the time constraints of our customers, presenting expedited shipping options on countless Boyd 341800f00000g - 76.2mm Length, 19.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. items. With all of this in mind, get in touch with a team member today to see how we can help you secure all the products you require.

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